PBT BASF B6550
PBT BASF B6550
PBT BASF B6550 is high‑viscosity, unreinforced PBT resin. Its high‑viscosity property makes it especially suitable for extrusion processing to produce various profiles and semi‑finished products.
Main Applications
Profiles & bars: semi‑finished goods, profiles, hollow bars. Fiber‑optic cables: loose buffer tubes for fiber‑optic cable systems. Electrical & electronics: connectors, switch components, home‑appliance parts (good electrical insulation). Automotive industry: radiator grilles, body panels, wheel covers, door‑window components. Household appliances: food‑processing blades, vacuum‑cleaner parts, electric fans, hair‑dryer housings, coffee‑maker accessories. Building industry: residential & sanitary facility applications.
Physical‑Mechanical‑Thermal‑Electrical Properties
| Property Category | Property Item | Test Standard / Condition | Test Data / Range | Unit |
|---|---|---|---|---|
| Physical Properties | Density | ISO 1183 | 1.30 | g/cm³ |
| MVR (250 ℃ / 2.16 kg) | ISO 1133 | 9.5 | cm³/10min | |
| Water absorption (23 ℃/24h, saturated) | ISO 62 | 0.50 | % | |
| Water absorption (23 ℃,50 %RH, equilibrium) | ISO 62 | 0.25 | % | |
| Molding shrinkage (flow direction) | ISO 294‑4 | 1.7 | % | |
| Molding shrinkage (transverse direction) | ISO 294‑4 | 2.1 | % | |
| Mechanical Properties | Tensile strength | ISO 527‑2 | 54.0 | MPa |
| Elongation at break | ISO 527‑2 | ＞50 | % | |
| Tensile modulus | ISO 527‑2 | 2400 | MPa | |
| Tensile creep modulus (1000 h) | ISO 899‑1 | 1100 | MPa | |
| Flexural strength | ISO 178 | 85.0 | MPa | |
| Charpy notched impact (23 ℃) | ISO 179/1eA | 6.0 | kJ/m² | |
| Ball indentation hardness | ISO 2039‑1 | 130 | MPa | |
| Thermal Properties | HDT @0.45 MPa | ISO 75‑2/B | 135 | ℃ |
| HDT @1.8 MPa | ISO 75‑2/A | 55.0 | ℃ | |
| Melting point | ISO 11357‑3 | 223 | ℃ | |
| CLTE | ISO 11359‑2 | 1.3‑1.6×10⁻⁴ | cm/cm/℃ | |
| Thermal conductivity | DIN 52612 | 0.27 | W/m/K | |
| UL94 rating | UL94 | HB (0.4 mm) | class | |
| Electrical Properties | Volume resistivity | IEC 60093 | 1.0×10¹⁶ | Ω·cm |
| Surface resistivity | IEC 60093 | 1.0×10¹³ | Ω | |
| Relative permittivity (100 Hz) | IEC 60250 | 3.4 | — | |
| Relative permittivity (1 MHz) | IEC 60250 | 3.3 | — | |
| Dissipation factor (100 Hz) | IEC 60250 | 20×10⁻⁴ | — | |
| Dissipation factor (1 MHz) | IEC 60250 | 200×10⁻⁴ | — |
Extrusion & Injection‑Molding Parameters
| Process Stage | Parameter Item | Reference Range / Recommendation | Unit / Remarks |
|---|---|---|---|
| Pre‑treatment | Drying temperature | 110‑120 (air drying) | ℃ |
| Drying time | 3‑5 | h | |
| Target moisture content | 0.03‑0.05 | % | |
| Drying equipment | Desiccant dryer recommended | — | |
| Extrusion | Rear barrel temperature | 220‑240 | ℃ |
| Middle barrel temperature | 240‑260 | ℃ | |
| Front barrel temperature | 250‑270 | ℃ | |
| Die temperature | 250‑270 | ℃ | |
| Melt temperature range | 225‑275 | ℃ | |
| Recommended melt temperature | 250 | ℃ | |
| Injection molding | Melt temperature range | 250‑270 | ℃ |
| Mold temperature | 50‑75 | ℃ | |
| Injection pressure | Medium | MPa | |
| Injection speed | Medium speed | — | |
| Mold | Runner type | Round runner recommended | — |
| Gate type | Multiple gate types available | — | |
| Mold cooling | Optimize cooling channels to reduce part warpage | — | |
| Post‑processing | Annealing (if required) | Reduce residual stress & improve dimensional stability | ℃ |
| Annealing time | Adjust according to wall thickness | h |
Note: All data above is for reference only.
